The MINIWARE® MHP Series includes the MHP30 Mini Hot Plate Preheater and the MHP50 Series. Since the launch of the MHP Series, it has been widely recognized by electronics users around the world for its compact size, high power, and modular split design. Building on this foundation, MINIWARE introduces the MHP50 Mini Solder Pot—an intelligent constant-temperature tool designed for precise tasks such as batch wire tinning,
small PCB rework, and component lead tinning. Using the same control unit, the MHP50 Series supports three interchangeable heating modules, creating a flexible all-in-one heating ecosystem:
- Solder Pot:Ideal for batch wire tinning, precision dip soldering, small PCB rework, and component
lead tinning.
- Hot Plate:Designed for PCB preheating, rework, curing, and other flat-surface heating tasks.
- Soldering Station Adapter:Works with different soldering tips for handheld precision soldering.
Users can switch easily between the hot plate, soldering station, and solder pot by simply changing the heating module. Power input and controls stay the same across all modules, so there’s no need to learn a new system. This modular ecosystem not only reduces repeat purchase costs for users, but also gives distributors more flexibility for accessory sales and product bundles.
Key Features
- Dedicated App Connectivity: Set parameters with one tap for smarter, easier control.
- Compact Size, 150W High Power: Faster, more even heating performance.
- Triple-Layer Heat Isolation Structure (with three utility patents): Better heat dissipation and improved stability.
- Bent Anti-Splash Tray: Catches solder splashes and debris for easier cleanup.
- Digital Display + Gradient Status Lighting: Real-time temperature display with color-changing lights that visually indicate temperature ranges at a glance.
- Multi-Language Support: Chinese, English, Russian, and German.
- Modular Ecosystem: Compatible with interchangeable MHP50 modules (hot plate, soldering station adapter, solder pot) for greater versatility.
Specifications
- Solder Pot Capacity:30×30×9.3mm,integrated above the dedicated heating module
- Pot Material:Heat- and corrosion-resistant metal for long-term solder use
- Solder Capacity:Approx. 70 g
- Melting Performance: Fully melts solder in about 2 minutes with stable temperature control
- Control Unit Height : Only 3.7 cm, low-profile sandwich design with low center of gravity for better stability
- Heat Isolation Structure: Stainless steel structural design with multi-layer heat separation for safer handling, better heat control, and improved long-term stability.
- Interface:160×80 color LCD + two physical buttons for simple, intuitive control
- Power Input:
DC(5525 Port,19-24V,150W)
PD(20-28V ,130W)
- Intelligent Features: Temperature curves, preset temperatures, tip-over protection, auto sleep, brightness control, firmware updates
- Applications: Batch wire tinning, small PCB desoldering, component lead tinning, and other precision soldering tasks
- Safety Design: Stainless steel tray around the solder pot catches splashes and solder debris, helping prevent internal contamination and making cleanup easier
Notes
• Please do not connect both the DC port and USB-C port at the same time.
• Solder pot accessory is available for individual purchase.
Certifications
CE、FCC、UKCA、RoHS
Package Includes
MHP50 Solder Pot Set:
MHP50 Control Unit x1
Type-C-C Cable x1
Mini Solder Pot x1
User Manual x1
MHP50 Solder Pot Accessory:
Mini Solder Potx1
QC Cardx1










